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  1 05131.r7 3/07 www.protekdevices.com sfc05-4 flip chip array 05131 applications ? cellular phones ? personal digital assistant (pda) ? ground positioning system (gps) ? smart & pcmcia cards iec compatibility (en61000-4) ? 61000-4-2 (esd): air - 15kv, contact - 8kv ? 61000-4-4 (eft): 40a - 5/50ns ? 61000-4-5 (surge): 24a, 8/20s - level 2(line-gnd) & level 3(line-line) features ? esd protection > 25 kilovolts ? 300 watts peak pulse power per line (tp = 8/20s) ? protects up to four (4) unidirectional lines ? rohs compliant mechanical characteristics ? quad flip chip package ? weight 0.73 milligrams (approximate) ? available in lead-free plating ? solder reflow temperature: lead-free - sn/ag/cu, 96/3.5/0.5: 260-270c ? consult factory for leaded device availability ? flammability rating ul 94v-0 ? 8mm plastic & paper tape and reel per eia standard 481 ? top contacts: solder bump 0.004? in height (nominal) pin configuration quad 6 5 4 1 2 3 bottom view
2 05131.r7 3/07 www.protekdevices.com sfc05-4 device characteristics electrical characteristics per line @ 25c unless otherwise specified operating temperature symbol v alue -55 to 150 c c -55 to 150 units t a t stg parameter storage temperature peak pulse power (tp = 8/20s) - see figure 1 p pp 300 watts maximum ratings @ 25c unless otherwise specified part number minimum breakdown voltage @ 1ma v (br) volts maximum clamping voltage (see fig. 2) @ i p = 5a v c volts maximum clamping voltage (see fig. 2) @8/20s v c @ i pp typical capacitance @0v, 1 mhz c j pf sfc05-4 5.0 6.0 9.5 11.0v @ 24a 150 maximum leakage current @v wm i d a 10 rated stand-off voltage v wm volts 0 5 10 15 20 25 30 t - time - s 0 20 40 60 80 100 120 i pp - peak pulse current - % of i pp test waveform parameters t f = 8s t d = 20s t f peak value i pp e -t t d = t i pp /2 figure 2 pulse wave form 0.01 1 10 100 1,000 10,000 t d - pulse duration - s 10 100 1,000 10,000 p pp - peak pulse current - watts figure 1 peak pulse power vs pulse time 300w, 8/20s waveform
3 05131.r7 3/07 www.protekdevices.com sfc05-4 graphs 0 5 10 15 20 v c - clamping voltage - volts 0 4 8 12 14 figure 5 typical clamping voltage vs peak pulse current 10 6 2 i pp - peak pulse current - amps esd test pulse - 25 kilovolt, 1/30ns (waveshape) figure 4 overshoot & clamping voltage 5 volts per division -5 5 15 25 35 0 25 50 75 100 125 150 t a - ambient temperature - c 20 40 60 80 100 % of rated power peak pulse power 8/20s average power figure 3 power derating curve 0
4 05131.r7 3/07 www.protekdevices.com sfc05-4 application information ramp-up ramp-down ramp-up 15 seconds solder time 15-20 seconds ramp-down t s - preheat t smax t smin t l t 25c to peak 30-60 seconds temperature - c t p 155 140 0.275mm round non-solder mask defined pads 0.325mm round 0.150mm 0.330mm round no clean osp(entek cu plus 106a) 50m 20m 60 seconds 270c pad size on pcb pad shape pad definition solder mask opening solder stencil thickness solder stencil aperture opening (laser cut, 5% tapered walls) solder paste type pad protective finish tolerance - edge to corner ball solder ball side coplanarity maximum dwell time above liquidous (183c) soldering maximum temperature printed circuit board recommendations parameter value requirements temperature: t p for lead-free (snagcu): 260-270c t p for tin-lead: 240-245c preheat time and temperature depends on solder paste and flux activation temperature, component size, weight, surface area & plating. recommended non-solder mask defined pad illustration non-solder mask defined pad 0.275mm dia. solder mask opening 0.325mm dia. solder stencil opening 0.330mm dia.
5 05131.r7 3/07 www.protekdevices.com sfc05-4 quad package outline & dimensions a b c e f g h i 0.510 0.510 0.99 0.0254 0.15 nom 1.5 0.0254 0.15 nom see note 3 0.076 min 0.419 nom 0.020 0.020 0.039 0.001 0.066 nom 0.059 0.001 0.006 nom see note 3 0.003 min 0.0165 nom dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). 3. ?h? dimensions for the sfc05-4 device are from 0.10mm max and 0.004? max. package outline mounting pad layout - option 1 a b c d e f g 0.305 0.457 0.203 0.254 0.510 0.990 0.510 note: 1. preferred: using 0.1mm (0.004?) stencil. 0.012 0.018 0.008 0.010 0.020 0.039 0.020 pad dimensions dim millimeters inches g h e f i side a b c top end solder print 0.010? - 0.012? dia. a f b g solder pads c e solder mask die solder bumps d
6 05131.r7 3/07 www.protekdevices.com sfc05-4 copyright ? prot ek devices 2007 specifications: protek reserves the right to change the electrical and or mechanical characteristics described herein without notice (except jedec). design changes: protek reserves the right to discontinue product lines without notice, and that the final judgement concerning selection and specifications is the buyer?s and that in furnishing engineering and technical assistance, protek assumes no responsibility wit h respect to the selection or specifications of such products. protek devices 2929 south fair lane, tempe, az 85282 tel: 602-431-8101 fax: 602-431-2288 e-mail: sales@protekdevices.com web site: www.protekdevices.com quad package outline & dimensions a b c d e 1.499 0.152 nom 0.510 0.990 0.510 0.059 0.006 nom 0.020 0.039 0.020 dim millimeters inches package dimensions notes: 1. controlling dimensions in inches. 2. decimal tolerances for mounting pad and outline: .xxx 0.05mm ( 0.002?). 3. preferred: using 0.1mm (0.004?) stencil. mounting pad layout - option 2 tape & reel orientation note: 1. top view of tape. solder bumps are face down in tape package. solder print 0.014? [0.36] dia. a d e b c solder mask die solder bumps copper cont acts 0.009? [0.23] dia. 1 2 3 6 5 4 outline & dimensions: rev 1 - 11/01, 06039 tape & reel ordering nomenclature 1. surface mount product is taped and reeled in accordance with eia 481. 2. 8mm plastic tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-, i.e., sfc05-4-t75-1. 3. 8mm paper tape: 7 inch reels - 5,000 pieces per reel. ordering suffix: -t75-2, i.e., sfc05-4-t75-2. 4. suffix - lf = lead-free, i.e., SFC05-4-LF-T75-2.


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